Showing results: 46 - 60 of 112 items found.
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MASER Engineering B.V.
MASER Engineering has automatic test equipment for the most common ESD test pulse models. MIL - JEDEC - ESDA - IEC standards. IC level Human Body Model. IC level Machine Model. IC level Charged Device Model. System level IEC 61000 HBM. AEC-Q100 Field Induced Gate Leakage test. Static Latch-Up test. Dynamic Latch-Up test.
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UNIVANS Co., Ltd.
IC Package It is a device to install INTERFACE between TESTER and DEVICE during TEST to check electrical defects such as O / S (Open, Short) test, mounting test, BURN-IN TEST and RLC TEST, The device
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LogicVision, Inc.
Mentor’s comprehensive solution for IC test, including best-in-class design-for-test tools and test data analytics that help ensure the highest test coverage, accelerate yield ramp and improve the quality and reliability of manufactured parts.
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Ironwood Electronics
No matter how well designed a circuit is, there is almost always a need to hook up test instruments to it to verify function, look for bugs, or baseline performance. As IC packages become smaller and pin counts grow this becomes harder and harder. probing adapters are required to alleviate this de-bug problem. Many different types of adapters fall into the test and debug category. The common feature is that they bring the signals of an IC out to a format that is easy to interface with test and analysis equipment.
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Japan Electronic Materials Corp.
The probe card is a tool for testing semiconductors used at "Wafer Test" to check quality of IC or LSI in the first process of semiconductor manufacturing. The probe card is expendable.
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Integrated Service Technology -
Integrated Service Technology Inc.
iST (Integrated Service Technology Inc.) is a leading lab-service company, specializing in the development of IC product testing & analysis, failure analysis, debugging, reliability test, material analysis. Apart from developing testing technologies for the upstream IC design and semiconductor industries, iST also expanded to provide a full-spectrum of services for the mid and downstream companies in the electronics industry.
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MicroContact AG
Frequently, manual test adapters are required for the functional and IC test. In order to contact the test subject, spring contact probes are often installed in the adapter, but the pitch of the spring contact probes is approx. 1.27 mm and thus too great for certain applications.
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TS9000 Family -
Advantest Corp.
The TS9000 series leverages Advantest's industry-leading terahertz analysis technology and expertise amassed over our decades as a global leader in semiconductor test equipment. This system provides a new high-speed, high-precision solution for measurement and analysis tasks including IC chip mold thickness and IC package / printed board wiring quality, which existing methods cannot measure adequately.
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MICRONICS JAPAN CO.LTD.
U-Probe for Multi-die Test of Memory IC. Vertical-Probe Needle Type Probe card suitable for multi-die test of devices with peripheral pads. ertical-Probe Spring Type. Probe card suitable for area array pad test. 64DUTs Multi-Die. Probe Card for RF devices. Fine Pitch.
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Qmax Test Technologies Pvt. Ltd.
Boundary Scan Trainer Kit was developed by Qmax to provide user a good understanding and hands on the testing principals of boundary scan namely the scan chain test, interconnect test, non-BS functional testing of logic IC and cluster like a combinational or sequential circuits.
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5114 -
Pomona Electronics
Pomona DIP Clip? test clips are designed fortesting dual-in-line IC packages on PC boards. Thesedevices incorporate many built-in features that assurea positive electrical connection as well as hands freetesting.
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5014 -
Pomona Electronics
Pomona DIP Clip test clips are designed fortesting dual-in-line IC packages on PC boards. Thesedevices incorporate many built-in features that assurea positive electrical connection as well as hands freetesting.
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National Technical Systems
The ever advancing electronics industry requires an increasing need for electronic component testing (IC testing) and component verification. The component test capabilities and component verification lab at NTS performs test and inspection to determine proper component functionality, verification or failure analysis (F/A).
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MicroContact AG
With the micro probes and the fine-pitch adapters used on them, you are able to contact the finest test structures. E-tests, functional tests, IC tests or high-current tests are made to be affordable, efficient and with a short cycle time. With the integration of HF adapters we also enable the double-sided testing of HF substrates up to high frequency ranges.
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DiagnoSYS Systems Ltd
The PinPoint Alpha system is a flexible, adaptable and modular PCB and IC fault finding system, which allows you to apply different electronic test methods to obtain maximum test coverage and fault detection. Test signals can be applied at the PCB edge connector or through test clips and DTIs to perform fixtureless in-circuit testing.